INTERNATIONAL PATENT: SJ SEMICONDUCTOR (JIANGYIN) CORPORATION, 盛合晶微半导体（江阴）有限公司 FILES APPLICATION FOR "2.5D PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR"

GENEVA, Feb. 8 -- SJ SEMICONDUCTOR (JIANGYIN) CORPORATION (9 Dongsheng West Road, Jiangyin CityWuxi, Jiangsu 214437), 盛合晶微半导体（江阴）有限公司 (中国江苏省无锡市江阴市东盛西路9号) filed a patent application (PCT/CN2025/109997) for "2.5D PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR" on Jul 22, 2025. With publication no. WO/2026/026617, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World I...