INTERNATIONAL PATENT: SHISEIDO COMPANY, LTD., 株式会社 資生堂 FILES APPLICATION FOR "COATING-TYPE FILM-FORMING AGENT, KIT INCLUDING SAID FORMING AGENT AND METHOD OF USING SAID FORMING AGENT"

GENEVA, May 27 -- SHISEIDO COMPANY, LTD. (5-5, Ginza 7-chome, Chuo-ku, Tokyo1040061), 株式会社　資生堂 (東京都中央区銀座７－５－５) filed a patent application (PCT/JP2024/039815) for "COATING-TYPE FILM-FORMING AGENT, KIT INCLUDING SAID FORMING AGENT, AND METHOD OF USING SAID FORMING AGENT" on Nov 08, 2024. With publication no. WO/2025/105304, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HIROISHI...