INTERNATIONAL PATENT: SHIN-ETSU HANDOTAI CO., LTD., 信越半導体株式会社 FILES APPLICATION FOR "PINHOLE AND DEAERATION FAILURE INSPECTION METHOD FOR BAG BODY IN WHICH SEALED STORAGE CONTAINER IS HERMETICALLY PACKAGED AND PINHOLE AND DEAERATION FAILURE INSPECTION DEVICE FOR BAG BODY IN WHICH SEALED STORAGE CONTAINER IS HERMETICALLY PACKAGED"

GENEVA, March 24 -- SHIN-ETSU HANDOTAI CO., LTD. (2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo1000004), 信越半導体株式会社 (東京都千代田区大手町二丁目２番１号) filed a patent application (PCT/JP2024/028939) for "PINHOLE AND DEAERATION FAILURE INSPECTION METHOD FOR BAG BODY IN WHICH SEALED STORAGE CONTAINER IS HERMETICALLY PACKAGED, AND PINHOLE AND DEAERATION FAILURE INSPECTION DEVICE FOR BAG BODY IN WHICH SEALED STORAGE CONTAINER IS HERMETICALLY PACKAGED" on Aug 13, 2024. With publication no. WO/2025/057644, the details related to the patent application was published on Mar 20, 2025.

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