INTERNATIONAL PATENT: SHIBAURA MECHATRONICS CORPORATION, 芝浦メカトロニクス株式会社 FILES APPLICATION FOR "SUBSTRATE SEPARATION DEVICE AND SUBSTRATE PROCESSING DEVICE"

GENEVA, Feb. 17 -- SHIBAURA MECHATRONICS CORPORATION (5-1, Kasama 2-chome, Sakae-ku, Yokohama-shi, Kanagawa2478610), 芝浦メカトロニクス株式会社 (神奈川県横浜市栄区笠間二丁目５番１号) filed a patent application (PCT/JP2024/023170) for "SUBSTRATE SEPARATION DEVICE AND SUBSTRATE PROCESSING DEVICE" on Jun 26, 2024. With publication no. WO/2025/033008, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World ...