INTERNATIONAL PATENT: SHENZHEN GUODIAN TECHNOLOGY COMMUNICATION CO., LTD., 深圳市国电科技通信有限公司, SHENZHEN SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, 深圳智芯微电子科技有限公司 FILES APPLICATION FOR "CHIP PACKAGING STRUCTURE"

Posted On: 2025-03-16

GENEVA, March 16 -- SHENZHEN GUODIAN TECHNOLOGY COMMUNICATION CO., LTD. (1st/F, Building 13, Hualian Industrial Park, Xinshi CommunityDalang Street, Longhua DistrictShenzhen, Guangdong 518109), 深圳市国电科技通信有限公司 (中国广东省深圳市龙华区大浪街道新石社区华联工业区13栋1层), SHENZHEN SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED (C901, Building 6, Northwest Shenjiu Science And Technology Pioneer ParkFubao Community, Fubao Street, Futian DistrictShenzhen, Guangdong 518045), 深圳智&#...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: SHENZHEN GUODIAN TECHNOLOGY COMMUNICATION CO., LTD., 深圳市国电科技通信有限公司, SHENZHEN SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, 深圳智芯微电子科技有限公司 FILES APPLICATION FOR "CHIP PACKAGING STRUCTURE"