GENEVA, Aug. 3 -- SHANGHAI ZHENGSHI TECHNOLOGY CO., LTD. (West Side Of Building 2, No. 500 Huapu RoadQingpu District, Shanghai 201700), 上海征世科技股份有限公司 (中国上海市青浦区华浦路500号2幢西侧) filed a patent application (PCT/CN2024/097661) for "METHOD FOR IMPROVING QUALITY OF JOINT BETWEEN DIAMONDS" on Jun 06, 2024. With publication no. WO/2025/156541, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...