INTERNATIONAL PATENT: SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTD, 上海赢朔电子科技股份有限公司 FILES APPLICATION FOR "WAFER CLAMPING MECHANISM FOR TURRET-TYPE DIE BONDING DEVICE"

GENEVA, Nov. 9 -- SHANGHAI YINGSHUO ELECTRONIC TECHNOLOGY CO., LTD (Building 2, No. 389 Jiuyuan RoadQingpu District, Shanghai 201712), 上海赢朔电子科技股份有限公司 (中国上海市青浦区久远路389号2幢) filed a patent application (PCT/CN2025/083130) for "WAFER CLAMPING MECHANISM FOR TURRET-TYPE DIE BONDING DEVICE" on Mar 18, 2025. With publication no. WO/2025/227971, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectu...