INTERNATIONAL PATENT: SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD, 上海先方半导体有限公司, NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "THREE-DIMENSIONAL OPTOELECTRONIC INTEGRATED PACKAGING STRUCTURE AND FORMING METHOD THEREFOR"

GENEVA, Jan. 11 -- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD (Room 801, Building B, No. 2305 Zuchongzhi Road, Pilot Free Trade ZonePudong New Area, Shanghai 200000), 上海先方半导体有限公司 (中国上海市浦东新区自由贸易试验区祖冲之路2305号B幢801室), NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体封装先导技术研发中心有限公司 (中&...