INTERNATIONAL PATENT: SHANGHAI TIANMA MICROELECTRONICS CO., LTD., 上海天马微电子有限公司 FILES APPLICATION FOR "POLYIMIDE RESIN AND USE THEREOF"

GENEVA, Feb. 20 -- SHANGHAI TIANMA MICROELECTRONICS CO., LTD. (No.889, Huiqing RoadPudong New Area, Shanghai 201201), 上海天马微电子有限公司 (中国上海市浦东新区汇庆路889号) filed a patent application (PCT/CN2024/123311) for "POLYIMIDE RESIN AND USE THEREOF" on Oct 08, 2024. With publication no. WO/2026/036491, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JIN, Jian (No.889, Huiq...