INTERNATIONAL PATENT: SHANGHAI SIMWINGS TECHNOLOGY CO., LTD, 上海新傲芯翼科技有限公司 FILES APPLICATION FOR "BONDED WAFER EDGE TREATMENT METHOD AND BONDED WAFER"

GENEVA, Oct. 3 -- SHANGHAI SIMWINGS TECHNOLOGY CO., LTD (1st Floor, Building 2, No. 168, Xinlai RoadJiading District, Shanghai 201815), 上海新傲芯翼科技有限公司 (中国上海市嘉定区新徕路168号2幢1楼) filed a patent application (PCT/CN2025/084305) for "BONDED WAFER EDGE TREATMENT METHOD AND BONDED WAFER" on Mar 24, 2025. With publication no. WO/2025/201229, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Or...