INTERNATIONAL PATENT: SHANGHAI SHYNDEC PHARMACEUTICAL CO., LTD., 上海现代制药股份有限公司 FILES APPLICATION FOR "ANTI-CORROSION DEVICE FOR INNER PACKAGING MOLD"

GENEVA, May 16 -- SHANGHAI SHYNDEC PHARMACEUTICAL CO., LTD. (378 Jianlu RoadPudong New Area, Shanghai 200000), 上海现代制药股份有限公司 (中国上海市浦东新区建陆路378号) filed a patent application (PCT/CN2024/104618) for "ANTI-CORROSION DEVICE FOR INNER PACKAGING MOLD" on Jul 10, 2024. With publication no. WO/2025/097825, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TANG, Y...