INTERNATIONAL PATENT: SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD, 上海中欣晶圆半导体科技有限公司 FILES APPLICATION FOR "CVD PROCESS METHOD AND SYSTEM FOR IMPROVING EPITAXIAL AUTO-DOPING OF POLISHED WAFER SUBSTRATE"

GENEVA, Oct. 26 -- SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD (Building 1, No 181 Shanlian RoadBaoshan District, Shanghai 200444), 上海中欣晶圆半导体科技有限公司 (中国上海市宝山区山连路181号1幢) filed a patent application (PCT/CN2024/110877) for "CVD PROCESS METHOD AND SYSTEM FOR IMPROVING EPITAXIAL AUTO-DOPING OF POLISHED WAFER SUBSTRATE" on Aug 09, 2024. With publication no. WO/2025/218058, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) syst...