INTERNATIONAL PATENT: SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD, 上海中欣晶圆半导体科技有限公司 FILES APPLICATION FOR "CHAMFER PROCESSING PROCESS FOR AMELIORATING ROUGHNESS OF CHAMFERED SURFACE OF SILICON WAFER"

GENEVA, Feb. 1 -- SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD (Building 1, No 181 Shanlian RoadBaoshan District, Shanghai 200444), 上海中欣晶圆半导体科技有限公司 (中国上海市宝山区山连路181号1幢) filed a patent application (PCT/CN2024/110879) for "CHAMFER PROCESSING PROCESS FOR AMELIORATING ROUGHNESS OF CHAMFERED SURFACE OF SILICON WAFER" on Aug 09, 2024. With publication no. WO/2026/020514, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system,...