INTERNATIONAL PATENT: SHANGHAI FUDAN MICROELECTRONICS GROUP COMPANY LIMITED, 上海复旦微电子集团股份有限公司 FILES APPLICATION FOR "HIGH-SPEED SERDES TRANSMITTER MODULE, PROGRAMMABLE LOGIC CHIP AND TEST METHOD"

GENEVA, June 22 -- SHANGHAI FUDAN MICROELECTRONICS GROUP COMPANY LIMITED (Building 4 No.127, Guotai Rd.Yangpu District, Shanghai 200433), 上海复旦微电子集团股份有限公司 (中国上海市杨浦区国泰路127号复旦国家大学科技园4号楼) filed a patent application (PCT/CN2024/132876) for "HIGH-SPEED SERDES TRANSMITTER MODULE, PROGRAMMABLE LOGIC CHIP AND TEST METHOD" on Nov 19, 2024. With publication no. WO/2025/124076, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was s...