INTERNATIONAL PATENT: SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD., 上海朕芯微电子科技有限公司, HUANG, PING, 黄平 FILES APPLICATION FOR "EMBEDDED PACKAGING STRUCTURE AND PACKAGING METHOD"

Posted On: 2026-01-11

GENEVA, Jan. 11 -- SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD. (No.455, Xiaonan Road,Fengxian District, Shanghai 201400), 上海朕芯微电子科技有限公司 (中国上海市奉贤区肖南路455号), HUANG, Ping (No.455, Xiaonan Road,Fengxian District, Shanghai 201400), 黄平 (中国上海市奉贤区肖南路455号) filed a patent application (PCT/CN2025/095755) for "EMBEDDED PACKAGING STRUCTURE AND PACKAGING METHOD" on May 19, 2025. With publication no. WO/2026/007558, the details related to the patent application was published on Jan 08, 202...

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INTERNATIONAL PATENT: SHANGHAI FINE CHIP SEMICONDUCTOR CO., LTD., 上海朕芯微电子科技有限公司, HUANG, PING, 黄平 FILES APPLICATION FOR "EMBEDDED PACKAGING STRUCTURE AND PACKAGING METHOD"