INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "HIGH-HEAT-RESISTANCE LOW-DIELECTRIC EPOXY RESIN COMPOSITION AND PREPARATION AND USE THEREOF"

Posted On: 2025-09-28

GENEVA, Sept. 28 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. (Room 101, Building 4, No. 19 Zhenglang Road, Lingang New Area, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 200120), 上海道宜半导体材料有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区正琅路19号4幢101室) filed a patent application (PCT/CN2024/142471) for "HIGH-HEAT-RESISTANCE LOW-DIELECTRIC EPOXY RESIN COMPOSITION, AND PREPARATION AND USE THEREOF" on Dec 25, 2024. Wit...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "HIGH-HEAT-RESISTANCE LOW-DIELECTRIC EPOXY RESIN COMPOSITION AND PREPARATION AND USE THEREOF"