INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "EPOXY RESIN MOLDING MATERIAL FOR C-MOLD PROCESS AND PREPARATION METHOD THEREFOR AND USE THEREOF"

Posted On: 2026-01-11

GENEVA, Jan. 11 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. (Room 101, Building 4, No. 19 Zhenglang Road, Lingang New Area, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 200120), 上海道宜半导体材料有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区正琅路19号4幢101室) filed a patent application (PCT/CN2024/142473) for "EPOXY RESIN MOLDING MATERIAL FOR C-MOLD PROCESS AND PREPARATION METHOD THEREFOR AND USE THEREOF" on Dec 25, 2024. W...

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INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "EPOXY RESIN MOLDING MATERIAL FOR C-MOLD PROCESS AND PREPARATION METHOD THEREFOR AND USE THEREOF"