INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "EPOXY RESIN COMPOSITION CAPABLE OF LOW-TEMPERATURE RAPID CURING AND INJECTION MOLDING AND PREPARATION METHOD THEREFOR"

Posted On: 2025-07-28

GENEVA, July 28 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. (Room 101, Building 4, No. 19 Zhenglang Road, Lingang New Area, China (Shanghai) Pilot Free Trade ZonePudong New Area, Shanghai 200120), 上海道宜半导体材料有限公司 (中国上海市浦东新区中国（上海）自由贸易试验区临港新片区正琅路19号4幢101室) filed a patent application (PCT/CN2024/142474) for "EPOXY RESIN COMPOSITION CAPABLE OF LOW-TEMPERATURE RAPID CURING AND INJECTION MOLDING, AND PREPARATION METHOD THERE...

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INTERNATIONAL PATENT: SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD., 上海道宜半导体材料有限公司 FILES APPLICATION FOR "EPOXY RESIN COMPOSITION CAPABLE OF LOW-TEMPERATURE RAPID CURING AND INJECTION MOLDING AND PREPARATION METHOD THEREFOR"