GENEVA, Dec. 22 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-Hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2025/019399) for "SOLDER BALL MOUNTING DEVICE" on May 29, 2025. With publication no. WO/2025/258402, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAKAMURA Hideki (c/o SENJU METAL INDUSTR...