GENEVA, July 9 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-Hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2024/046051) for "SOLDER ALLOY, SOLDER BALL, SOLDER PASTE, AND SOLDERED JOINT" on Dec 25, 2024. With publication no. WO/2025/143073, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YOKOYAMA ...