GENEVA, June 17 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2024/041303) for "PREFORM SOLDER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MANUFACTURING SOLDER JOINT" on Nov 21, 2024. With publication no. WO/2025/121150, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (...