GENEVA, Aug. 5 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2025/001885) for "JOINING MATERIAL AND METHOD FOR MANUFACTURING SAME, AND SOLDER JOINT AND METHOD FOR MANUFACTURING SAME" on Jan 22, 2025. With publication no. WO/2025/159119, the details related to the patent application was published on Jul 31, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...