GENEVA, July 8 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-Hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2024/042968) for "JET SOLDER DEVICE" on Dec 05, 2024. With publication no. WO/2025/142371, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SHINOHARA Katsuhiro (c/o SENJU METAL INDUSTRY CO., ...