GENEVA, Sept. 30 -- SEKISUI TECHNO MOLDING CO., LTD. (2-10-4, Toranomon, Minato-ku, Tokyo1058566), 積水テクノ成型株式会社 (東京都港区虎ノ門２丁目１０番４号) filed a patent application (PCT/JP2025/010332) for "RESIN COMPOSITION AND RESIN MOLDED PRODUCT" on Mar 18, 2025. With publication no. WO/2025/197878, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NISHIKAWA,...