GENEVA, Oct. 5 -- SEKISUI POLYMATECH CO., LTD. (8-10-1 Tajima, Sakura-ku, Saitama-city, Saitama3380837), 積水ポリマテック株式会社 (埼玉県さいたま市桜区田島八丁目１０番１号) filed a patent application (PCT/JP2025/012949) for "THERMALLY CONDUCTIVE MOLDED BODY" on Mar 28, 2025. With publication no. WO/2025/206366, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizat...