GENEVA, Feb. 4 -- SEKISUI KASEI CO., LTD. (4-4, Nishitenma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化成品工業株式会社 (大阪府大阪市北区西天満二丁目４番４号) filed a patent application (PCT/JP2024/025827) for "RESIN PARTICLES AND RESIN COMPOSITION FOR SEMICONDUCTOR MEMBERS" on Jul 18, 2024. With publication no. WO/2025/023151, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Orga...