GENEVA, March 31 -- SEKISUI KASEI CO., LTD. (4-4, Nishitenma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化成品工業株式会社 (大阪府大阪市北区西天満二丁目4番4号) filed a patent application (PCT/JP2024/029223) for "HOLLOW RESIN PARTICLES, USE THEREOF, AND METHOD FOR PRODUCING SAME" on Aug 16, 2024. With publication no. WO/2025/062901, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property...