GENEVA, June 2 -- SEKISUI HOUSE, LTD. (1-1-88, Oyodonaka, Kita-ku, Osaka-shi Osaka5310076), 積水ハウス株式会社 (大阪府大阪市北区大淀中一丁目１番８８号) filed a patent application (PCT/JP2023/041598) for "FLOOR STRUCTURE" on Nov 20, 2023. With publication no. WO/2025/109645, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): NAKAMURA Takeshi (c/o SEKISUI HOUSE,...