GENEVA, July 3 -- SEKISUI HOUSE, LTD. (1-1-88, Oyodonaka, Kita-ku, Osaka-shi, Osaka5310076), 積水ハウス株式会社 (大阪府大阪市北区大淀中１丁目１番８８号) filed a patent application (PCT/JP2024/040360) for "CONNECTION STRUCTURE FOR STEEL MATERIAL AND BUILDING" on Nov 13, 2024. With publication no. WO/2025/134618, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s)...