GENEVA, Feb. 4 -- SEKISUI FULLER COMPANY, LTD. (16-2, Konan 2-chome, Minato-ku, Tokyo1080075), 積水フーラー株式会社 (東京都港区港南二丁目１６番２号) filed a patent application (PCT/JP2024/025830) for "THERMOPLASTIC RESIN COMPOSITION" on Jul 18, 2024. With publication no. WO/2025/023152, the details related to the patent application was published on Jan 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HIKASA, Yuri (c/o Sekisui Fuller Company,...