GENEVA, Sept. 9 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2025/006866) for "METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND WOUND BODY" on Feb 27, 2025. With publication no. WO/2025/183085, the details related to the patent application was published on Sep 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which i...