GENEVA, April 1 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2024/033423) for "IMIDE RESIN MATERIAL, CURABLE RESIN COMPOSITION, ADHESIVE FILM, TEMPORARY FIXING MATERIAL, AND METHOD FOR PRODUCING IMIDE RESIN MATERIAL" on Sep 19, 2024. With publication no. WO/2025/063226, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (...