GENEVA, March 10 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2024/029864) for "CONDUCTIVE PASTE, RFID INLAY, AND METHOD FOR PRODUCING RFID INLAY" on Aug 22, 2024. With publication no. WO/2025/047577, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organ...