GENEVA, Oct. 5 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2025/011125) for "ADHESIVE COMPOSITION, ADHESIVE TAPE, RESIN MOLDED BODY, COMPOSITE STRUCTURE, AUTOMOBILE MEMBER, AND METHOD FOR PRODUCING RESIN MOLDED BODY" on Mar 21, 2025. With publication no. WO/2025/205461, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification ...