GENEVA, June 29 -- SBT ULTRASONIC TECHNOLOGY CO., LTD. (3F Building 2rd, No.1488 Cangyuan RoadMinhang District, Shanghai 200240), 上海骄成超声波技术股份有限公司 (中国上海市闵行区沧源路1488号2幢三层) filed a patent application (PCT/CN2023/141795) for "ULTRASONIC WEDGE BONDER, AND BONDING HEAD ASSEMBLY AND DESIGN METHOD THEREFOR" on Dec 26, 2023. With publication no. WO/2025/129728, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, wh...