GENEVA, July 7 -- SBT ULTRASONIC TECHNOLOGY CO., LTD (3f Building 2rd, No.1488 Cangyuan RoadMinhang District, Shanghai 200240), 上海骄成超声波技术股份有限公司 (中国上海市闵行区沧源路1488号2幢三层) filed a patent application (PCT/CN2024/128832) for "METHOD FOR CONTROLLING ULTRASONIC BONDING PROCESS" on Oct 31, 2024. With publication no. WO/2025/139344, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World In...