INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD., 삼성전자 주식회사, HOYEON.CO.,LTD, 주식회사 호연 FILES APPLICATION FOR "APPARATUS FOR SEPARATING AT LEAST PART OF ASSEMBLY"

GENEVA, Sept. 30 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro, Yeongtong-guSuwon-siGyeonggi-do 16677), 삼성전자 주식회사 (경기도수원시영통구 삼성로 129), HOYEON.CO.,LTD (26-9 Suchul-daero 5-gilGumi-siGyeongsangbuk-do 39267), 주식회사 호연 (경상북도구미시수출대로 5길 26-9) filed a patent application (PCT/KR2025/001972) for "APPARATUS FOR SEPARATING AT LEAST PART OF ASSEMBLY" on Feb 11, 2025. With publication no. WO/2025/198186, the details related to the patent application was published on Sep 25, 2025.

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