INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD., 삼성전자 주식회사, DNSMOLDETCHING CO., LTD., 주식회사 디앤에스몰드에칭 FILES APPLICATION FOR "COATING SOLUTION USED FOR SURFACE COATING OF MOLD AND SURFACE COATING METHOD FOR MOLD"

Posted On: 2025-04-07

GENEVA, April 7 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677), 삼성전자 주식회사 (경기도수원시 영통구삼성로 129), DNSMOLDETCHING CO., LTD. (764-15 Saam-ro,Gwangsan-gu,Gwangju 62244), 주식회사 디앤에스몰드에칭 (광주광역시광산구사암로 764-15) filed a patent application (PCT/KR2024/014664) for "COATING SOLUTION USED FOR SURFACE COATING OF MOLD AND SURFACE COATING METHOD FOR MOLD" on Sep 26, 2024. With publication no. WO/2025/071308, the details ...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD., 삼성전자 주식회사, DNSMOLDETCHING CO., LTD., 주식회사 디앤에스몰드에칭 FILES APPLICATION FOR "COATING SOLUTION USED FOR SURFACE COATING OF MOLD AND SURFACE COATING METHOD FOR MOLD"