GENEVA, Aug. 19 -- SAMSUNG C＆T CORPORATION (26, Sangil-ro 6-gilGangdong-guSeoul 05288), 삼성물산 주식회사 (서울특별시강동구상일로6길 26) filed a patent application (PCT/KR2024/002668) for "SLAB ANCHORING ROBOT DEVICE FOR EXTENSION, AND SLAB ANCHORING METHOD THEREFOR" on Feb 29, 2024. With publication no. WO/2025/170099, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LEE, Seung Hyeok (339-dong 903...