GENEVA, June 11 -- ROBOCON TECHNOLOGIES CORP. (B, 16-4 Gajangsaneopseobuk 1-roOsan-si,Gyeonggi-do 18102), 로보콘 주식회사 (경기도오산시가장산업서북1로 16-4, B동), SAMSUNG C&T CORPORATION (26 Sangil-ro 6-gilGangdong-gu,Seoul 05288), 삼성물산 주식회사 (서울특별시강동구상일로6길 26) filed a patent application (PCT/KR2024/018827) for "BINDING DEVICE FOR ASSEMBLING REINFORCING BAR FOR TUNNEL CONSTRUCTION" on Nov 26, 2024. With publication no. WO/2025/116471, the details related to the patent appli...