INTERNATIONAL PATENT: RMATERIALS CORPORATION, 알머티리얼즈 주식회사 FILES APPLICATION FOR "LOW-COST AND HIGH-STRENGTH THERMOELECTRIC MODULE MANUFACTURING METHOD HAVING SIMPLIFIED MANUFACTURING PROCESS"

GENEVA, April 20 -- RMATERIALS CORPORATION (222ho, 14 Seocheon-ro 201beon-gil, Giheung-guYongin-siGyeonggi-do 17111), 알머티리얼즈 주식회사 (경기도용인시기흥구 서천로201번길 14, 222호) filed a patent application (PCT/KR2024/003280) for "LOW-COST AND HIGH-STRENGTH THERMOELECTRIC MODULE MANUFACTURING METHOD HAVING SIMPLIFIED MANUFACTURING PROCESS" on Mar 15, 2024. With publication no. WO/2025/079791, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manag...