GENEVA, Aug. 11 -- RM TOHCELLO CO., LTD. (7, Kandamitoshiro-cho, Chiyoda-ku, Tokyo1018485), アールエム東セロ株式会社 (東京都千代田区神田美土代町7) filed a patent application (PCT/JP2025/000871) for "POLYETHYLENE FILM, PACKAGING MATERIAL, AND PACKAGE" on Jan 14, 2025. With publication no. WO/2025/164286, the details related to the patent application was published on Aug 07, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIDOKORO Masako (...