INTERNATIONAL PATENT: RM TOHCELLO CO., LTD., アールエム東セロ株式会社 FILES APPLICATION FOR "PACKAGING FILM, PACKAGING MATERIAL AND PACKAGING"

GENEVA, April 28 -- RM TOHCELLO CO., LTD. (7, Kandamitoshiro-cho, Chiyoda-ku, Tokyo1018485), アールエム東セロ株式会社 (東京都千代田区神田美土代町７) filed a patent application (PCT/JP2024/035291) for "PACKAGING FILM, PACKAGING MATERIAL, AND PACKAGING" on Oct 02, 2024. With publication no. WO/2025/084142, the details related to the patent application was published on Apr 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAMURA Takuya (c/...