GENEVA, Oct. 5 -- RM TOHCELLO CO., LTD. (7, Kandamitoshiro-cho, Chiyoda-ku, Tokyo1018485), アールエム東セロ株式会社 (東京都千代田区神田美土代町7) filed a patent application (PCT/JP2025/008845) for "LAMINATED FILM, PACKAGING MATERIAL, AND PACKAGE" on Mar 10, 2025. With publication no. WO/2025/204818, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SUZUKI Shingo (c/o RM...