GENEVA, Sept. 30 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/009019) for "THERMOSETTING RESIN FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE" on Mar 11, 2025. With publication no. WO/2025/197679, the details related to the patent application was published on Sep 25, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...