INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "THERMOSETTING ADHESIVE COMPOSITION, ULTRAVIOLET-IRRADIATED PRODUCT OF SAME, LAMINATED FILM AND METHOD FOR PRODUCING CONNECTION BODY"

GENEVA, April 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/033538) for "THERMOSETTING ADHESIVE COMPOSITION, ULTRAVIOLET-IRRADIATED PRODUCT OF SAME, LAMINATED FILM, AND METHOD FOR PRODUCING CONNECTION BODY" on Sep 19, 2024. With publication no. WO/2025/063250, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World In...