GENEVA, April 1 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/033541) for "THERMOSETTING ADHESIVE COMPOSITION, LAMINATED FILM, AND CONNECTION BODY AND METHOD FOR PRODUCING SAME" on Sep 19, 2024. With publication no. WO/2025/063252, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizatio...