INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET"

GENEVA, May 5 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2023/038774) for "THERMALLY CONDUCTIVE SHEET, HEAT DISSIPATION DEVICE, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE SHEET" on Oct 26, 2023. With publication no. WO/2025/088766, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizati...