INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SUBSTRATE FOR FILLER, METHOD FOR PRODUCING SUBSTRATE FOR FILLER, FILLER AND METHOD FOR PRODUCING PROTEIN"

GENEVA, Aug. 19 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/003826) for "SUBSTRATE FOR FILLER, METHOD FOR PRODUCING SUBSTRATE FOR FILLER, FILLER, AND METHOD FOR PRODUCING PROTEIN" on Feb 05, 2025. With publication no. WO/2025/169969, the details related to the patent application was published on Aug 14, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiz...