INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SHEET-LIKE MEMBER, RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE"

GENEVA, May 27 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/040367) for "SHEET-LIKE MEMBER, RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE" on Nov 13, 2024. With publication no. WO/2025/105404, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s...